| Key Features | ||
| Capacity | 512GB | |
| Form Factor | M.2 2280 | |
| Flash Type | 3D TLC | |
| Interface | PCIe Gen4x4 | |
| Sequential R/W | Sequential read up to 7450MB/s, write up to 3500MB/s | |
| MTBF | 1,500,000 Hours | |
| TBW | 500TBW | |
| Physical Specification | ||
| Dimension | 80 x 22 x 10 mm / 3.15” x 0.87” x 0.39” | |
| Weight | 54g / 0.12lbs | |
| Temperature | ||
| Operating Temperature | 0° C to 70° C (32°F to 158°F) | |
| Storage Temperature | -40° C to 85° C (-40°F to 185°F) | |
| Shock resistance | 1500G, duration 0.5ms, Half Sine Wave | |
| Vibration Resistance | 10~2000Hz, 1.5mm, 20 G, 1 Oct/min, 30min/axis(X,Y,Z) | |
| Warranty | ||
| Manufacturing Warranty | 5 years | |
| Key Features | ||
| Capacity | 512GB | |
| Form Factor | M.2 2280 | |
| Flash Type | 3D TLC | |
| Interface | PCIe Gen4x4 | |
| Sequential R/W | Sequential read up to 7450MB/s, write up to 3500MB/s | |
| MTBF | 1,500,000 Hours | |
| TBW | 500TBW | |
| Physical Specification | ||
| Dimension | 80 x 22 x 10 mm / 3.15” x 0.87” x 0.39” | |
| Weight | 54g / 0.12lbs | |
| Temperature | ||
| Operating Temperature | 0° C to 70° C (32°F to 158°F) | |
| Storage Temperature | -40° C to 85° C (-40°F to 185°F) | |
| Shock resistance | 1500G, duration 0.5ms, Half Sine Wave | |
| Vibration Resistance | 10~2000Hz, 1.5mm, 20 G, 1 Oct/min, 30min/axis(X,Y,Z) | |
| Warranty | ||
| Manufacturing Warranty | 5 years | |
Lexar
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