PRIME X670-P

PRIME X670-P

X670-P

ASUS Prime series motherboards are expertly engineered to unleash the full potential of AMD Ryzen 7000-series processors. Boasting a robust power design, comprehensive cooling solutions and intelligent tuning options, PRIME X670-P provides users and PC DIY builders with a range of performance optimizations via intuitive software and firmware features.

• 

  12+2 DrMOS Power Stages (60A) with Enlarged Heatsinks

Gen 5 Slot for Storage

DDR5 Support

USB 3.2 Gen 2x2 Type-C®

2.5 Gb Ethernet

• 

  Intelligent Control

Al Cooling II

Customization

• AM5 Socket for AMD Ryzen™
  7000 Series Desktop Processors

• Expansion Slots
  ・1 x PCIe 4.0 x16 (supports x16 mode)
   SafeSlot Core+
  ・2 x PCIe 4.0 x16 (support x4 mode)
  ・1 x PCIe 3.0 x1

• 12+2 DrMOS

• 4 x DIMM
  ・DDR5 6400+(OC)
  ・Dual Channel
  ・OptiMem II

• 3 x M.2 Slots
  ・1 x M.2 2280 (PCIe 5.0 x4 mode)
  ・1 x M.2 22110 (PCIe 4.0 x4 mode)
  ・1 x M.2 2280 (PCIe 4.0 x4 mode)

• VRM Heatsinks

• M.2 Heatsink

• CHA Fan Header

• Chipset Heatsink

• CPU OPT Fan Header

• AIO PUMP Fan Header

• CPU Fan Header

• CHA Fan Header

• CHA Fan Header

• 1 x Addressable Gen 2 Header

• 2 x Addressable Gen 2 Headers

• 2 x Aura RGB Headers

• 1 x PS/2

• 2 x USB 2.0 (2 x Type-A)

• BIOS FlashBack™ button

• HDMI®

• DisplayPort

• 4 x USB 3.2 Gen 1 (4 x Type-A)

• 1 x USB 3.2 Gen 2x2
  (1 x USB Type-C®)

• 3 x USB 3.2 Gen 2 (3 x Type-A)

• 2.5 Gb Ethernet

• 3 x Audio jacks

• V-M.2 slot (KeyE)

• 1 x USB 3.2 Gen 1 connector
  (supports USB Type-C®)

• 1 x USB 3.2 Gen 1 header supports
  additional 2 USB 3.2 Gen 1 ports

• 2 x SATA 6Gb/s ports

• 1 x Thunderbolt™ (USB4®) Header

• 1 x USB 3.2 Gen 1 header supports additional 2 USB 3.2 Gen 1 ports

• 4 x SATA 6Gb/s ports

• 2 x USB 2.0 headers support
  additional 4 USB 2.0 ports

FLEXIBILITY

Comprehensive controls form the foundation of the ASUS PRIME series. The PRIME X670 motherboard packs flexible tools to tune every aspect of your system, enabling performance tweaks to perfectly match the way you work to maximize productivity.

Intelligent Control

CPU Performance Boost

AMD Precision Boost Overdrive(PBO) pushes the CPU current and voltage budget to opportunistically increase performance. By aggressively tuning the PBO parameters, AMD‘s algorithm can leverage the motherboard’s robust power solution to ramp up performance even higher.

COOLING

PRIME X670 series is engineered with multiple onboard heatsinks and an array of hybrid fan headers to ensure your rig stays cool and stable under intense workloads.

Heatsinks

Removable captive screws reduce risk of drops or loss during heatsink removal.

M.2 Heatsink

An M.2 heatsink takes care of the M.2 slot, warding off throttling that can occur with M.2 storage during sustained transfers.

VRM Heatsinks and High-quality Thermal Pads

Two massive VRM heatsinks and high-quality thermal pads improve heat transfer from the MOSFETs and chokes for better cooling performance.

Passive Chipset Heatsink

An aluminum passive chipset heatsink ensures optimal cooling for more stable performance. The passive heatsink approach is more durable and longer-lasting, avoiding dust and dirt build-up problems often encountered by conventional active heatsinks with dedicated fan designs.